Industrial Excimer Laser Processing System | Flexible Production Line Integration & Fully Customizable Parameters

Product Details:

Place of Origin: CHINA
Brand Name: OSMANUV
Certification: ISO9001
Model Number: Specification

Payment & Shipping Terms:

Minimum Order Quantity: 1 set
Price: Negotiation
Packaging Details: WOOD PACKAGING
Delivery Time: 30-45 days
Payment Terms: T/T
Supply Ability: Negotiation
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Detail Information

Voltage: 220V/380V Conveyor Speed: 25~80m/min
Main Motor Power: 1.5KW Effective Leveling Width: 920mm
Coating Material: Various Materials Uvlamptype: Mercury Lamp
Rewinding Folding Error: ±0.1mm Drying Type: IR Drying

Product Description

Industrial Excimer Laser Processing System
Flexible Production Line Integration & Fully Customizable Parameters
Product Overview

This industrial excimer laser processing system is designed for high-precision microfabrication, semiconductor annealing, and thin-film patterning. It supports full integration into automated production lines with real-time monitoring. The system features a gas-sealed excimer source with long lifetime optics and AI-assisted process control.

Production Line Composition
  • Excimer laser source unit
  • Beam shaping & homogenization module
  • High-speed XY scanning stage or mask projection unit
  • Inline substrate handling robot (customizable track width)
  • Exhaust & gas management system
  • Process control PC with recipe manager
Technical Parameters
Parameter Value Range (Standard) Customization Option
Wavelength 193 nm / 248 nm / 308 nm Multi-wavelength switchable (custom)
Max pulse energy 0.5 - 1200 mJ Up to 2000 mJ (custom)
Pulse frequency 1 - 6000 Hz Up to 10 kHz (custom)
Average power 5 - 300 W Custom scaling available
Beam size (exit) 10 × 10 mm Rectangular beam up to 50×50 mm (custom)
Beam homogeneity < ±3% (σ) < ±1% (custom optics)
Production line integration SMEMA / SECS/GEM Custom PLC protocol (custom)
Applications
  • Silicon annealing for advanced displays (LTPS)
  • MEMS & semiconductor wafer dicing
  • Polymer surface activation
  • Medical device micro-structuring
  • Flexible PCB drilling
Customization Options

We offer full customization of wavelength selection, pulse energy, scanning field size, gas mixture, cooling method (air/water/chiller), and production line communication protocol. Customized beam delivery arms and class-1 enclosures are also available upon request.

Key Features
  • > 2000 hours gas lifetime (optimized gas mixture)
  • Built-in energy stabilization (real-time feedback)
  • Remote diagnostics & predictive maintenance
  • Low cost of ownership (LOO) with bypass gas-saving mode
  • Compact modular design for quick line reconfiguration
Support and Services
  • 24/7 technical support (phone/remote)
  • On-site installation & production line integration
  • Custom training for your engineers
  • Extended warranty up to 5 years
  • Gas refill & optics refurbishment program
Packing and Shipping
  • Sealed in moisture-controlled, shock-dampened container
  • Vacuum-sealed optics box
  • Shipping via air or sea with real-time tracking
  • Export crates meet ISPM-15 standard
Frequently Asked Questions
Q1: Can you customize the laser head size for a compact production line?
Yes, the laser head and beam delivery path are fully customizable to fit narrow or odd-shaped line spaces.
Q2: What is the lead time for a customized system?
Standard: 8-10 weeks; customized: 12-14 weeks including design validation.
Q3: Do you support integration with existing MES?
Yes, we provide custom SECS/GEM, OPC-UA, or Modbus interfaces.

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